Basic Information

Asset # :

KSC676 / 006

Available Qty :

1

Inspections - Yellow Tag :

4. Used: Powered up in our shop and appears to be functional

Shipping Options

Packaging Cost :

3.1 Oak Pallet $45

Factory Information

Capacity of up to 12 InfraStake modules InfraStake | Staking Plastic with Infrared Light

The InfraStake technology is a staking process that uses infrared light as the energy source. The process takes place in four basic phases:

1. Clamping
2. Heating
3. Staking & Cooling
4. Punch Retracts

1) Clamping
The InfraStake module is positioned over the molded stud or boss. The face of the concentrator provides optimum part clamping directly at the staking joint.

2) Heating
The heating phase begins when the lamp is illuminated. This 100-watt, technical-grade, lamp emits infrared (IR) light energy that is focused radially on the perimeter of the stud. Gold-plated reflector and concentrator components achieve this focus with engineered reflective geometries.

3) Staking & Cooling
At the end of the heating cycle, the lamp is switched off, and the low-impact air cylinder with integrated staking punch is activated, which forms over the semi-molten stud. When we mention "low-impact," it is important to note that the stud is heated evenly and the force required to form it is typically as low as 15-25 lbs. That means low stresses in the plastic and less potential damage to sensitive components in the proximity of the operation (e.g., PCB staking applications). The staking punch is not heated; it is positioned in the module outside of the IR focal point. Cooling or hold time, therefore, is very efficient as the formed stud re-solidifies under pressure. Stringing/sticky plastic adhering to the punch is also a non-issue with InfraStake due to the 'cool' punch surface.

4) Punch Retracts
At the end of the programmed hold or punch time, the internal staking punch mechanism retracts. The module is retracted from the components, and the cycle is complete. The sub-assembly can be immediately handled.